(Cold plate system and TEC controller)
FCSW0052306
Model introduction
This device is a 4-inch wafer cooling system with built-in TEC modules. The cooling temperatures of surface are lapped with 0.05 ℃ tolerance. Compared to a pure embedded cold plate, the cooling capacity is more reliable and stable, and the plate surface temperature is more uniform. The device can meet customized needs with a shorter time.
Applications
Widely used in the semiconductor industry as a process adhesive developing device. The device can provide fast cooling for wafers.
Technical parameters
Model | FCSW0052306 | ||
Wafer Size | 4-inch | ||
Cooling method | Thermoelectric modules | ||
Radiating Method | Forced water-cooling | ||
Control Method | Cooling/Heating PID control | ||
Ambient Temperature/Humidity | 10~35℃, 35~80%RH | ||
Hot Surface Circulating Fluid | Factory cooling water | ||
Operating Temperature Range | 15.0~35.0℃ | ||
Cooling Capacity | 75W(25℃) | ||
Heating Capacity | 180W(25℃) | ||
Temperature Stability | ±0.05℃ | ||
Temperature Controller Model | FCSE0004820 | ||
Control Voltage | DC12~48V | ||
Factory cooling water |
Temperature Range | 15~30℃ | |
Pressure Range | ≤1MPa | ||
Required Flow Rate | 2~5L/min | ||
Wetted Parts Material | Stainless Steel 304 | ||
Actual Input Power | ≤150W | ||
Maximum Output Current | 18A | ||
Protection Function | Overload, short circuit, over-temperature | ||
Communications | RS485 |