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SiFusion Furnaceware

Pure poly silicon solutions
for LPCVD, High-Temperature
and other furnace processes

SiFusion, a division of Ferrotec's material solutions business, offers SiFusion pure poly silicon furnaceware — a breakthrough solution for front-end thermal processes. SiFusion uses patented technology manufacture of furnace-ware products from ultrapure poly silicon material.

Some examples of the SiFusion poly silicon furnaceware products that Ferrotec manufactures include:




SiFusion Polysilicon Boat SiFusion Polysilicon Injector SiFusion Polysilicon Liner
SiFusion Polysilicon Boat SiFusion Polysilicon Injector SiFusion Polysilicon Liner
 
SiFusion Polysilicon Pedestal SiFusion Polysilicon Ring Boat SiFusion Polysilicon Shelf Boat
SiFusion Polysilicon Pedestal SiFusion Polysilicon Ring Boat SiFusion Polysilicon Shelf Boat


High Temperature Processes

Furnaceware performs without deformities in demanding processes reaching temperatures up to 1350°C.
  • Reduced killer particles
  • No particle bursts
  • No breaking injectors
  • No peeling or flaking
  • No warping or deformation
  • No routine cleaning

LPCVD Processes

Low Pressure Chemical Vapor Deposition (LPCVD) processes, including silicon nitride and polysilicon, are important steps in wafer manufacturing, using the high diffusivity of gasses to create a uniform deposition thickness.

Typical SiFusion product life in LPCVD silicon nitride applications is more than 250 microns of cumulative deposition with no routine cleaning.

SiFusion components, made from pure poly silicon, significantly reduce fixture-generated particulates, a key concern in LPCVD processes. As deposition film thickness on furnace fixtures increases, thermal stress between the films and quartz or silicon carbide furnace fixtures results in the film’s fracturing, which in turn results in flaking. The resulting particle generation severely affects yield.

In LPCVD applications, SiFusion products deliver low particles without costly routine cleaning or associated hazardous wastes.

  • Low crystal slip and stress
  • Lower metallic contamination
  • Less contact point damage
  • Reduced boat marks
  • Reduced thermal stabilization times
  • Increased ramp rates
  • No deformation (up to 1350°C)
  • Boats

Additional Processes

In addition to LPCVD and high temperature processes, SiFusion furnaceware is ideally suited to amorphous silicon deposition. SiFusion’s ionically pure material does not add particles in the amorphous silicon deposition, allowing the active layer to meet the strict criteria for thin-film transistors. Wafers are easily contaminated by furnace fixtures’ corrosion and deformation during heating. SiFusion furnaceware can withstand thermal shock at temperatures far above those experienced by IC wafers. Its surface treatment diffuses stress to prevent flaking, maintaining a clean environment around the wafer.