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Aluminium Nitride Ceramics AlN

Aluminium Nitride is frequently selected for its thermal conductivity and its resistance to attack by fluorine plasmas.

Applications

  • Chamber parts for Semiconductor Process Equipment
  • Heat Radiation Substrate

Silicon Nitride Ceramics

Properties

      ALN99 ALN94
General Properties Characteristics High purity HighThermal Conductivity
Main Component Purity(wt%) 99 94
Color Light gray Light gray
Density(g/cm3) 3.24 3.31
Water Absorption(%) 0 0
Mechanical Properties Bending Strength(MPa) 295 345
Young's Modulus(GPa) 320 320
Vickers Hardness(GPa) 11 11
Thermal Properties Max.Operating Temperature (°C) 1000 1000
Coefficient of Thermal Expansion (1/°C×10-6) RT~500°C 4.4 4.4
RT~800°C 5.1 5.1
Coefficient of Thermal Conductivity (W/m×K) 80 150
Thermal Shock Resistance ΔT (°C) 300 400
Electrical Properties Volume Resistivity 25°C 1014 1014
300°C 108 1010
500°C 107 107
800°C 105 105
Dielectric Constant 10GHz 8.5 8.5
Dielectric Loss (×10-4) 30 30
Q Factor (×104) 0.03 0.03
Dielectric Breakdown Voltage (KV/mm) - -